Semiconductor device manufacturing relies on coating technology to prepare various functional thin films, including conductive, insulating, and barrier films. These thin films have a critical impact on the performance and reliability of semiconductor devices. The ESD (electrostatic discharge) anti-static coating prepared by PVD technology has excellent performance and wide application prospects.

ESD anti-static coating effectively resists external friction and wear, extending the service life of the coating. Coatings effectively prevent the accumulation and discharge of static electricity, protecting semiconductor devices from electrostatic damage. The coating's excellent corrosion resistance ensures that semiconductor devices remain stable and reliable in harsh environments.

ESD anti-static coating is applied to the surface of the wafer during the manufacturing process. This prevents static electricity from damaging the circuits on the wafer and improves yield and reliability. During the packaging process of integrated circuits, coatings are used on the surface of the packaging material. These coatings prevent static electricity from damaging the integrated circuit and improve the reliability and service life of the package.

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  Semiconductor Chuck and Base

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  lead frame

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  Semiconductor nozzle